具体要求:
1. 韩语会话流利,书写顺畅Korean speaking, both oral and writing
2. 理工科大学本科以上学历,具有半导体知识、微电子器件和设计经验,或者有半导体行业背景者优先Bachelor degree in Science/Engineering, prefer to have Semiconductor knowledge, Microelectronics Device or Device Design experience, or Semiconductor field background
3. 能熟练运用Office, PDFEdit等办公软件Good capability to operate Office, PDFEdit OA softwares
4. 工作细心,仔细,严谨,有耐心Strict, stable, attentive and with patient personality
岗位职责:
1. 与韩国开发团队合作进行新产品开发Cooperate with Design team in Korea for the product development
2. 对新产品开发项目协同个部门芯片厂、封装线、质量和工程部门进行跟进Follow up new product development status in cross functional team, wafer fab, assembly lines, quality and engineering
3. 同芯片厂沟通相应的设计问题并做相应的改进Communicate with Wafer Fab for the design issues and make improvements accordingly
4. 协同设计工程、芯片厂、封装线和客户将新产品从设计阶段引入到大规模量产Introduce new product from Design phase to mass production working with Design Engineering, Wafer Fab, Assembly Lines and Customers
5. 协同设计团队和制造部门共同解决客户问题并持续改进产品能力Cooperate with Design team and manufacturing team to solve the customer issues and Improve product capability continuously
6. 直接主管安排的其他任务Tasks assigned by immediate supervisor.